E-Beam systems
Vistec Electron Beam develops, manufactures, sells and services electron-beam lithography systems which are based on the Variable Shaped Beam (VSB) technology. The dedicated and tailored data preparation solution ePLACE (licenced by Vistec Electron Beam) ensures a perfect link between design and lithography performance. The portfolio covers electron-beam lithography systems with 200 mm and 300 mm platforms. This high flexibility gives access to a wide range of applications in R&D, prototyping, and small volume production.
The Vistec VSB systems combine state of the art fully automated substrate handling, adjustment and alignment with a high-precision stage system and a sophisticated electron-optical 50 keV column specifically developed to ensure excellent lithography performance. All Vistec systems featuring exposure strategies as “write-on-the-fly”, vector scan and multi-pass exposure.
Thanks to the production-compatible Graphical User Interface (GUI) the Vistec systems can be easily integrated into automated production environments (CIM). The lithography system is compliant to semiconductor production environments and prepared for remote monitoring and control according to SEMI equipment automation standards.
VSB-TECHNOLOGY
Variable Shaped Beam technology enables writing directly on a substrate with different shapes and sizes of the electron-beam. The shape and size variation is performed with high-speed electron optics. These generated single electron-beam shots are projected in to the target level according to previous fracturing of the layout data. The shot size can be varied in 1 nm steps or less, ranging from smallest dots or long narrow rectangles to square areas with up to 2 µm edge length. This variability in shot size is the prerequisite for efficient exposures, especially on large areas.
In case of highly repetitive patterns “Cell Projection – (CP)” is an option. In addition to the standard rectangle shapes more complex characters are used to shape the electron beam. The Cell Projection feature enhances throughput and pattern fidelity of repetitive or curvilinear structures.
VISTEC SB3050-2
The Vistec SB3050-2 is today’s most advanced Electron Beam Lithography system with Variable Shaped Beam technology and full writing capability on mask or wafer substrates of up to 300 mm dimension.
Key Features
- Substrate sizes: Wafers from 2" up to 300 mm, 5" - 9" masks
- Substrate handling: Fully automated handling via SMIF / FOUP pod
- Clean room footprint: < 30 m² (SB3050-2 incl. service area)
VISTEC SB254
The Vistec SB254 electron beam lithography system has been designed as a universal and cost-effective tool for both direct write and mask making applications to allow the customers to react quickly to market demands.
With its 210 mm x 210 mm stage travel range it is the ideal tool for exposing masks up to 7 inch and wafers up to 200 mm diameter.
Key Features
- Substrate sizes: Wafers from 2" up to 200 mm, 5" - 7" masks
- Substrate handling: Fully automated handling via SMIF pod
- Clean room footprint: < 27 m² (SB254 incl. service area)
